pulse plating
英 [pʌls ˈpleɪtɪŋ]
美 [pʌls ˈpleɪtɪŋ]
网络 脉冲电镀; 脈衝電鍍; 脉波电流; 脉冲镀; 波流
双语例句
- Preparation of Ni-Mo Alloy Coating by Pulse Plating and Its HER Activity
脉冲电镀制备Ni-Mo合金镀层及其析氢性能 - A control method based on neural network for pulse plating power is presented, and a mathematical model of the pulse transformer is established.
提出了一种用于脉冲电镀电源的神经网络控制器，并对脉冲变压器建立了数学模型。 - Effects of Reversible Pulse Plating on Anti-Tarnish Property of Silver Coating
双向脉冲电镀对银层抗变色能力的影响 - In this paper, the metal distribution in selective pulse plating is investigated.
研究了选择性脉冲电镀中的金属分布规律，以局部酸性镀铜为例讨论了脉冲峰值电流密度和工作比对铜镀层金属分布的影响。 - Selecting suitable pulse duration ratio and negative pulse can be improved property of the zinc coating corrosion-resisting and also can be reduced hardness and brittleness of the zinc coating. This is a new discovery of pulse plating.
选择合适的脉冲占空比和负脉冲，可以提高镀锌层的防蚀性能，并可降低镀层的硬度与脆性，是脉冲镀的一个新发现。 - A Study on Pulse Parameters in Acid Copper Pulse Plating
酸性脉冲电镀铜中脉冲参数的作用研究 - Current parameters for pulse plating of Ni-Co alloy were optimized through investigation of their effects on the hardness of and the cobalt content in the obtained deposit.
研究了脉冲参数对电沉积Ni－Co合金镀层的钴含量与硬度的影响。确定了最佳的脉冲参数。 - In this paper, the designing of intelligent high speed reverse current pulse plating power supply with high capacity is studied.
介绍了大容量、智能化高速换向脉冲电镀电源装置的设计方案。 - Study on solderability of tin deposit by pulse plating
脉冲电镀锡层可焊性的研究 - Meantime the pulse plating was compared with the direct current process.
同时，对脉冲电镀与直流电镀进行了比较。 - Compound pulse gold plating technology combining pulse plating with direct current plating, i.e.alternating pulse current with direct current cyclically during electrodeposition is stated.
介绍脉冲电镀和直流电镀结合为一体的复合脉冲镀金技术，即在电沉积过程中，周期性地交替使用脉冲电流和直流电流。 - Influences of pulse plating parameters on micro-hardness of nickel deposits
脉冲电镀中脉冲参数对镍镀层显微硬度的影响 - Study of cathode current distribution in pulse plating
脉冲电镀中阴极电流分布规律 - Research of Pulse Plating Gold Process Technology
脉冲选择电镀金加厚工艺技术研究 - Influences of Pulse Plating and DC Plating on the Performance of Tungsten Coating
脉冲镀和直流镀对钨镀层性能的影响 - A Study of Abrasion Resistance of Gold Coatings with Pulse Plating
脉冲镀金层耐磨性能的研究 - Pulse plating of Nickel Three pulse cancellation method is used and the PRF is programmable.
该对消器采用三脉冲对消方案，脉冲重复频率可编程。 - The Fundamental Conception of Pulse Plating and the Investigation of the Optimal Parameter Ranges
脉冲电镀基本概念和最佳参数的探讨 - The experiment results have shown that pulse plating have superiority over DC plating in these aspects.
实验结果表明脉冲镀层优于直流镀层。 - The pulse plating is a new plating technology and the pulse power is introduced.
脉冲电镀是一项新的电镀技术，脉冲电镀电源是发展的方向，针对脉冲电源这项新技术重点进行了介绍。 - Research on Pulse Plating Process of Ni-Al_2O_3 Composite Coating
脉冲电镀Ni-Al2O3复合镀层工艺研究 - Selection and Application of Power Supply Unit for Pulse Plating
脉冲电镀电源的选择和使用 - It's feasible to prepare nanocrystalline nickel deposit on uranium surface by pulse plating technology.
利用脉冲电镀在铀表面制备纳米镍镀层是可行的。 - The effect of pulse frequency and pulse duration ratio on the abrasion resistance of gold coatings is investigated with pulse plating in cyanide free and trace cyanide baths.
研究了脉冲电镀在微氰镀金，无氰镀金体系中脉冲频率、脉冲占空比对镀金层耐磨性的影响。 - Effects of pulse plating conditions on the composition, appearance and morphology of Pd/ Ag deposits on the filter plate of Type 316 stainless steel from ammoniacal bath have been described in this paper.
研究了氨性溶液中在316不锈钢滤板上脉冲电沉积把银合金时，电镀条件对镀层组成、表观形貌和金相结构的影响。 - Emphases are given on the composition of bath solution, pulse plating and laser plating.
对脉冲、选择、激光等镀金方法作了展望。 - Study on the Thiosulfate Cyanide-free Silver Pulse Plating Process
硫代硫酸盐无氰脉冲镀银工艺研究 - By analyzing the pulse plating principle, pulse plating can make the coating uniform with proper plating parameter.
通过对脉冲电镀的原理分析可知，合理选择脉冲参数，可以保证脉冲电镀镀层均匀、电镀效果好。 - The results showed that: in the same plating parameters, the pure nickel plating does not have coating of photo catalytic; DC Ni-TiO2 coating with photo catalytic though, but the performance and high-frequency pulse plating varied considerably.
结果表明：在相同电镀工艺条件下，纯镍电镀镀层不具有光催化性；直流Ni-纳米TiO2镀层虽具有光催化性，但性能和高频脉冲电镀相差很大。 - Pulse plating process was also studied.
为了进一步提高镀层质量，对脉冲电镀金工艺进行了研究。